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PCB Masking Tape is a green PET (polyester) high-temperature masking tape engineered specifically for printed circuit board assembly — protecting connectors, contact pads, gold fingers, and sensitive component areas through wave soldering, conformal coating, and cleaning. What sets it apart from general-purpose high-temp tapes is a low-ionic adhesive system that leaves no ionic contamination on the board, preserving surface insulation resistance (SIR) and preventing electrochemical migration — backed by RoHS and REACH documentation for electronics OEM qualification.
On a printed circuit board, a masking tape does more than hold a line through heat — it sits directly on conductive surfaces that must stay electrically clean. A tape with an ionic adhesive can transfer mobile ions to the board surface during thermal processing. Those residual ions lower surface insulation resistance (SIR) and, under bias and humidity, drive electrochemical migration — dendrite growth between conductors that can cause intermittent faults or latent shorts long after the board ships.
PCB Masking Tape uses a low-ionic adhesive formulation that avoids this failure mode while still meeting the demands of the assembly line: secure adhesion to FR4, copper, ENIG, HASL, and OSP finishes; a sharp, bleed-free edge that defines clean solder-mask boundaries; and full release after processing with no adhesive residue. Material compliance with RoHS and REACH is documented and available on request, so the tape passes incoming-material qualification for electronics manufacturers.
A low-ionic adhesive formulation prevents ionic contamination of PCB surfaces — critical for maintaining surface insulation resistance (SIR) and preventing electrochemical migration on high-reliability boards.
All materials comply with the RoHS Directive and REACH Regulation. Compliance documentation is available on request to support incoming-material qualification and electronics OEM audits.
The green PET backing withstands wave soldering and conformal coating thermal profiles, holding firm through processing heat without lifting, charring, or adhesive breakdown.
Formulated to bond securely to FR4 substrate, copper, ENIG, HASL, and OSP finishes — holding firmly through processing without lifting, while still releasing cleanly afterward.
Precise edge definition creates crisp boundaries between soldered and protected areas, with no adhesive bleed-under at the tape edge — essential for clean gold-finger and contact-pad masking.
Available in custom slit widths and die-cut profiles matched to specific connectors, gold-finger arrays, and component footprints for repeatable, operator-friendly masking.
| Backing Material | Green PET (polyester) film |
| Adhesive Type | Low-ionic, high-temperature pressure-sensitive adhesive |
| Ionic Contamination | Low-ionic — protects SIR, prevents electrochemical migration |
| Substrate Compatibility | FR4, copper, ENIG, HASL, OSP |
| Compliance | RoHS & REACH — documentation on request |
| Edge Performance | Sharp definition, no bleed-under |
| Width Range | Custom slit widths; die-cut shapes available |
| Roll Length | Standard 33m / 66m / custom |
| Removal | Clean release, no adhesive residue |
| MOQ | Flexible — samples available |
| Lead Time | Stock sizes 3–7 days · Custom 10–18 working days |
Masking connectors, gold fingers, and component areas through wave soldering, keeping solder off protected zones with a clean, sharp boundary.
Defining sharp keep-out boundaries around connectors and test points so conformal coating lands only where specified.
Shielding sensitive areas during cleaning processes and protecting ICT test points during assembly handling.
Protecting board surfaces, pads, and contacts from scuffing and contamination during assembly handling and transfer.
Residual ions left on a board surface lower surface insulation resistance (SIR) and can drive electrochemical migration under bias and humidity, causing latent shorts. The low-ionic adhesive avoids transferring mobile ions to the board, which is why this tape is specified for high-reliability assemblies.
This is a green PET tape optimized for wave soldering, conformal coating, and cleaning processes. For lead-free reflow soldering, which peaks at 250–260°C, a polyimide tape rated for those peak temperatures is the better choice — contact us and we’ll recommend the right grade for your reflow profile.
Yes. All materials are RoHS and REACH compliant, and compliance documentation is available on request to support your incoming-material qualification.
Yes. Custom die-cut masking shapes matched to specific connector profiles and gold-finger arrays are available. Contact us with your part geometry for a sample.
Suitable for distributors and manufacturers across Vietnam, Thailand, Malaysia, Singapore, and Indonesia. Contact us to verify compliance requirements for your specific market.
| Minimum Order | Flexible — contact us with your target quantity for confirmation |
| Sample Order | Available — sample cost refunded on first bulk order |
| Custom Print | Logo, design, and color printing supported (gravure up to 8 colors) |
| Custom Size | Full dimension customization available with no tooling fee (standard construction) |
| Lead Time | Stock sizes: 3–7 days · Custom production: 10–18 working days |
| Packaging | Export carton with inner poly-bag grouping; labeling to buyer spec |
All dimensions are fully customizable. Send your target size and quantity to [email protected] — we'll confirm feasibility and pricing within 24 hours.
Product data sheets and test reports are available upon request. Email [email protected] with your product and application details.
Email [email protected] or WhatsApp +86 186 6215 2620 with your dimensions and quantity. We respond within 24 hours.
Biodegradable, recyclable, and plastic-free alternatives across our product range — built to meet tightening regulations across Vietnam, Thailand, Malaysia, and beyond.